PCB Assembly Service

From our early days as a pioneer in surface mount technology (SMT) to our recent work in fiber optics and lead-free materials and processing, Sanmina-SCI offers the latest in materials, board sizes and finishes to improve performance.

Our strengths include:

• Lead-free components and processes
• Single- and double-sided SMT assembly
• Chip scale packaging
• Micro BGA
• Flip chip on Flex
• 0201 and 0402 chips
• Wirebound ICs
• CCGAs – I/O 625-1657
• CBGAs – I/O 256-937
• Conformal coating and ESS testing
• Class 1, 2 and 3 capabilities
• Backdrilling and blind via formation
• Buried Capacitance®
• Embedded passives

Design and Engineering. Representing the best talent in the industry, Sanmina-SCI’s engineering team provides seasoned engineering services to improve PCBAs and accelerate time-to-market. From conceptual design, new product introduction (NPI), and prototyping to material selection and purchasing, test development, and design improvement, Sanmina-SCI offers you a complete set of “design for excellence” services.

Flexible Manufacturing. With millions of square feet of manufacturing capacity, Sanmina-SCI provides flexible manufacturing options that adapt to cost targets, delivery requirements and fluctuating demands in volume. Our manufacturing facilities are closely linked with engineering resources, providing a fast ramp from prototype to volume production. Our manufacturing services include:

• Automated final assembly
• BGA assembly, rework and reballing
• Pin through hole (PTH) assembly
• Optical modules, fiber management and splicing
• Exotic fiber splice combinations
• Large board sizes
• Board thicknesses from 0.025″ to 0.150″
• 0.5-inch backplanes with active devices
• 12-mil pitch connectors/QFPs
• Press-fit connectors

Test Services. In addition to standard testing services, Sanmina-SCI offers the latest in testing technologies and techniques to meet your special requirements and specifications. Our testing services include:

• Functional test development
• In-circuit test (ICT)
• Flying probe
• X-ray laminography
• Automated optical inspection (AOI)
• JTAG boundary scan

For more information on Sanmina-SCI End-to-End solutions, Inquire Here!