End-To-End Solutions
PCB Fabrication Services
END-TO-END MANUFACTURING

Green Services
We partner with you and the environment

PCB Fabrication

PCB Assembly ServicesGlobal Solutions for Multilayer PCBs

With a total of eight production plants in three continents, our global manufacturing footprint enables Sanmina-SCI to provide complete end-to-end solutions of complex, multilayer PCBs. We are committed to providing you with the right global footprint, technologies and resources proven to lower cost and improve quality.

Design for Manufacturability (DFM) – We analyze your PCB design to ensure conformance to best-in-class manufacturing standards.

Quickturn Prototyping – We quickly produce prototypes and short-run pre-production boards to meet your time-to-market requirements.

New Product Introduction (NPI) – We establish PCB design rules that support a seamless transition to volume production.

High Volume Production – Get the local, regional and global manufacturing support you need. We have global PCB manufacturing facilities strategically located in North America, Asia and Europe.

Advanced Technology – We use cutting-edge technologies and processes to create cost-effective solutions that address your unique requirements.

To learn more about our PCB services and global footprint, contact us. PCB Services
Cost Ratio Calculator PCB Fabrication Calculator
Please note: All reference materials are in PDF format.
Locations Capabilities
Costa Mesa, California Singapore Kuching, East Malaysia
Owego, New York Wuxi, China San Jose, California
Design for Manufacturability
Backdrilling Signal Integrity Optivia™ Preferred Materials
BGA Routing App Note Panel Sizes PCB Fab Volume DFM
Buried Capacitance® & Embedded Passives
Buried Passives & Filters FaradFlex™ Presentation Buried Capacitance® Licensed Laminate Suppliers
Design Guidelines Buried Capacitance® Licensed Fabricators Buried Capacitance® Technical Overview
RoHS/WEEE
PCB RoHS Update Phenolic FR-4s  
Data & Analysis
CAF Resistant Material Resonance Test  
White Papers
Black Pad on ENIG Board Level Reliability Impact of Microvia-in-pad
Impact of Component Finish Impact of Intermetallic Distributed Matched Bypassing
Setting Capacitor ESR Thin Laminates for Power Distribution Overview of Backdrilling

For more information on Sanmina-SCI End-to-End solutions, Inquire Here!

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