Sanmina-SCI’s innovative strategy is a powerful differentiator. With highly skilled design and engineering personnel across our various markets and product segments, we help advance our customers’ technologies and products on a global scale.

For more than 25 years, our technological know-how has proven to drive down manufacturing costs while solving unique customer requirements. From backplane fabrication and assembly to complex integration and post-manufacturing repair/warranty services, our customers rely on our backplane solutions and expertise to meet their time-to-market and product innovation objectives.

Below are just a few examples of our innovation, expertise and manufacturing capabilities.

Click on a backplane image to enlarge it.
	46 Layers 0.304” Thick 16.150” Wide 39.153” Long GBX High-speed Connector System
	24 Layers 0.217” Thick 22.500” Wide 38.500” Long VHDM Connector System VHDM HSD Connector System
	30 Layers 0.200” Thick 15.250” Wide 16.500” Long GBX High-speed connector system
	30 Layers 0.200” Thick 15.250” Wide 16.500” Long GBX High-speed Connector System
	32 Layers 0.305” Thick 16.500” Wide 20.00” Long Orthogonal High-speed Connector System Zpack Max High-speed Connector System
	16 Layers 0.156” Thick 6.650” Wide 16.970” Long Hard Metric 2mm Connector Systems Micro BGAs
	Backplane fabrication and assembly Complex signal pathways for the entire system PCB systems cards that plug into the system Cabinet and cage integration 100% electrical testing
	Backplane fabrication and assembly Complex signal pathways for the entire system PCB systems cards that plug into the system Cabinet and cage integration 100% electrical testing

Large format backpanel technology.