We’ve offered a total solution for superior high-layer count PCBs found in today’s mission-critical and high-performance applications in telecommunications, defense and aerospace and medical.

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We’re able to design and fabricate complex backplanes up to 64 layers, 0.015” to 0.450” thick, and deliver them anywhere in the world.

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The power of a full-solution provider with focused engineering lies in the ability to provide customers with custom cable assembly, wiring, fiber optics, harnesses and electro-mechanical assembly all under one roof.

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Our Center of Excellence in Turtle Lake, Wisconsin, offers dedicated plastic injection molding and die casting engineering capabilities like Pro-E rendering and Moldflow analysis. Around the world, we have 50 injection molding machines from 28 to 1,000 tons and clean room molding.

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We understand both custom and standard cabinet design for indoor and outdoor applications. This expertise means shorter time to market.

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Whatever the frame size, volume or material, our engineering and manufacturing knowledge systematically drives down costs, shortens lead times and simplifies the supply chain.

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We innovate and make some of the most advanced DRAM technologies and Solid State Storage (SSD) solutions proven to optimize the value and performance of our customers’ applications.

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15+ PhDs are in-house at Sanmina specializing in optical engineering, developing new patents in optical design and processes so we can turn our customers’ ideas into reality.

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