From our early days as a pioneer in surface mount technology (SMT) to our recent work in fiber optics and lead-free materials and processing, Sanmina-SCI offers the latest in materials, board sizes and finishes to improve performance.
Our strengths include:
- Lead-free components and processes
- Single- and double-sided SMT assembly
- Chip scale packaging
- Micro BGA
- Flip chip on Flex
- 0201 and 0402 chips
- Wirebound ICs
- CCGAs – I/O 625-1657
- CBGAs – I/O 256-937
- Conformal coating and ESS testing
- Class 1, 2 and 3 capabilities
- Backdrilling and blind via formation
- Buried Capacitance®
- Embedded passives
Design and Engineering. Representing the best talent in the industry, Sanmina-SCI’s engineering team provides seasoned engineering services to improve PCBAs and accelerate time-to-market. From conceptual design, new product introduction (NPI), and prototyping to material selection and purchasing, test development, and design improvement, Sanmina-SCI offers you a complete set of “design for excellence” services.
Flexible Manufacturing. With millions of square feet of manufacturing capacity, Sanmina-SCI provides flexible manufacturing options that adapt to cost targets, delivery requirements and fluctuating demands in volume. Our manufacturing facilities are closely linked with engineering resources, providing a fast ramp from prototype to volume production. Our manufacturing services include:
- Automated final assembly
- BGA assembly, rework and reballing
- Pin through hole (PTH) assembly
- Optical modules, fiber management and splicing
- Exotic fiber splice combinations
- Large board sizes
- Board thicknesses from 0.025″ to 0.150″
- 0.5-inch backplanes with active devices
- 12-mil pitch connectors/QFPs
- Press-fit connectors
Test Services. In addition to standard testing services, Sanmina-SCI offers the latest in testing technologies and techniques to meet your special requirements and specifications. Our testing services include:
- Functional test development
- In-circuit test (ICT)
- Flying probe
- X-ray laminography
- Automated optical inspection (AOI)
- JTAG boundary scan
